Topic |
Session 1 | Stress calculation and simulation considering the heat of composite materials and semiconductors for actual design |
Session 2 | Stress calculation and simulation considering the heat of composite materials and semiconductors for actual design |
Session 3 | Thermal network method analysis based on electric circuit simulation for actual design |
Session 4 | Thermal network method analysis based on electric circuit simulation for actual design |
Session 5 | Thermal network method analysis based on electric circuit simulation for actual design |
Session 6 | Structural change simulation using experimental modal analysis for actual design |
Session 7 | Structural change simulation using experimental modal analysis for actual design |
Session 8 | Structural change simulation using experimental modal analysis for actual design |
Session 9 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 10 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 11 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 12 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 13 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 14 | Design and production of movement mechanism using mainspring / production of mobile robot by 3D printer |
Session 15 | Presentation of building a mobile robot |
**This content is based on April 1, 2024. For the latest syllabus information and details, please check the